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msap sip packaging substrate
Selling leads
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... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant ...
2024-12-09 20:55:08
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Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space...
2024-12-09 19:38:04
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Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0...
2024-12-09 19:57:48
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Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness...
2024-12-09 19:38:04
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 22:05:34
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...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ...
2024-12-09 19:45:11
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...Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications (0.3mmt for 1-2-1) Applicable ...
2024-12-09 20:55:08
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...package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC ...
2024-12-09 20:55:08
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...package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support ...
2024-12-09 19:38:04
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...Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash ...
2024-12-09 21:05:17
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