China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
1 - 10 of 47

ic package substrate

Selling leads

memory IC substrate manufacture for DDR/LPDDR

memory IC substrate manufacture for DDR/LPDDR for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

FCCSP Flipchip package substrate manufacture

FCCSP Flipchip package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

High-Performance SiP Package Substrate for IoT Electronics

High-Performance SiP Package Substrate for IoT Electronics for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

MEMS package substrate manufacture

MEMS package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

semiconductor FCCSP package substrate manufacture in HOREXS

semiconductor FCCSP package substrate manufacture in HOREXS for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 21:46:53

FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 21:44:49

FBGA/PBGA/LGA Package Semiconductor Substrate Manufacture

FBGA/PBGA/LGA Package Semiconductor Substrate Manufacture for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 21:20:17

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing for sale
Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR... 2024-12-09 21:20:17

Hitachi BT IC Package Substrate 0.29mm 4 Layer 0.5oz Copper Custom

Hitachi BT IC Package Substrate 0.29mm 4 Layer 0.5oz Copper Custom for sale
Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, ... 2024-12-09 21:20:17
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