bga substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

1 - 10 of 25

bga substrate

Selling leads

L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2026-09-14 19:24:25

BT material BGA semiconductor package Substrate production

All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconduct... 2026-09-14 19:21:57

4 Layer buildup types semiconductor Package Substrate production

POP Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate... 2026-09-14 19:21:57

MCP package Substrate 0.5oz Copper Customize BT Material

MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei ... 2026-09-14 19:21:57

ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct... 2026-09-14 19:21:57

BT material semiconductor Pacakge Substrate L/S 35/35um

BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate... 2026-09-14 19:21:57

BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface

MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you ... 2026-09-14 19:21:57

MGC brand BT CSP package Substrate Fabrication

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2026-09-14 19:21:57

IC Chip Substrate Fabrication with BT(MGC/Hitachi) ENIG/Soft gold/ENEPIG

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor ... 2026-09-14 19:19:05

BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line ... 2026-09-14 19:19:05

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