bga substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

11 - 20 of 25

bga substrate

Selling leads

BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness

Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0... 2024-12-09 19:57:48

L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2024-12-09 19:57:48

2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package... 2024-12-09 19:55:37

BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor ... 2024-12-09 19:55:37

ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package... 2024-12-09 19:55:37

semiconductor packaging Substrate of DRAM Memory manufacture

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:55:37

FBGA Package substrate production supporting BT 40um core

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate... 2024-12-09 19:55:37

ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material

Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics... 2024-12-09 19:55:37

microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of ... 2024-12-09 19:38:04

RF/mmwave module substrate manufacture

Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:38:04

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