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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

1 - 10 of 140 Selling leads

memory IC substrate manufacture for DDR/LPDDR

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

FCCSP Flipchip package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

High-Performance SiP Package Substrate for IoT Electronics

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

MEMS package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

FCBGA/BGA package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

semiconductor FCCSP package substrate manufacture in HOREXS

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 21:46:53

FCBGA/BGA package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 21:44:49

semiconductor FCCSP Package Substrate manufacture

Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ... 2024-12-09 21:44:49

FBGA/PBGA/LGA Package Semiconductor Substrate Manufacture

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 21:20:17

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width... 2024-12-09 21:20:17

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