21 - 30 of 140 Selling leads
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FMC NAND/Flash memory substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash ...
2024-12-09 20:55:08
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BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
2024-12-09 20:55:08
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Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...
2024-12-09 20:55:08
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PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & ...
2024-12-09 20:55:08
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stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with ...
2024-12-09 20:55:08
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Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ...
2024-12-09 20:55:08
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FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC ...
2024-12-09 20:55:08
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Camera/Bluetooth/Wireless Module substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera ...
2024-12-09 20:55:08
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All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconduct...
2024-12-09 20:39:36
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POP Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate...
2024-12-09 20:39:36
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