11 - 20 of 140 Selling leads
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FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal ...
2024-12-09 21:20:17
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Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR...
2024-12-09 21:20:17
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Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, ...
2024-12-09 21:20:17
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eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support ...
2024-12-09 21:20:17
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Precision 0.15mm IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of ...
2024-12-09 21:20:17
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BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
2024-12-09 21:20:17
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Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...
2024-12-09 21:20:17
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
2024-12-09 21:20:17
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Precision 0.15mm IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of ...
2024-12-09 21:05:17
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Hitachi BT IC Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF ...
2024-12-09 21:05:17
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