China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
Home > Products > IC Package Substrate >

Customizable coreless IC Package Substrate with 0.09mm Thickness

Browse Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details

Customizable coreless IC Package Substrate with 0.09mm Thickness

Brand Name Horexs
Certification UL
Place of Origin china
Minimum Order Quantity 1 square meter
Price US 0.11-0.13 each piece
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability 30000 square meters per month
Delivery Time 7-10 working days
Packaging Details carton customized
Application Industrial Ceramic
Material Alumina Ceramic
Size Size Customized
Shape Square
Density 3.65g/cm3
Warranty 1 year
Detailed Product Description

Hitachi BT IC Package Substrate production supporting

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage;

 

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.29mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:4 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK)

 

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

 

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrates,please also provide us layer stack-up information;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

 

Want Better price,Better quality substrate ? Contact Horexs now!

 

Application Of IC Package Substrate

  • bank card
  • IC card
  • SIM card
  • Dram memory electronics
  • Sd card
  • memory card,all kind of memory card
Product Tags: Hitachi BT IC Package Substrate   IC Package Substrate Size Customized   Square BT IC Package Substrate  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: HongRuiXing (Hubei) Electronics Co.,Ltd.
Subject:
Message:
Characters Remaining: (80/3000)