Customizable coreless IC Package Substrate with 0.09mm Thickness

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Customizable coreless IC Package Substrate with 0.09mm Thickness

Hitachi BT IC Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF ...

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Product Tags: Hitachi BT IC Package Substrate IC Package Substrate Size Customized Square BT IC Package Substrate

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