HongRuiXing (Hubei) Electronics Co.,Ltd.

Horexs as one of the famous IC substrate manufacturers in CHINA,We support 2-6L including buildup for customers,Whatever your product use for.Since our factory built,we also built our R&D team to support our customer technical problem,So,during OEM/ODM,when you want to make your idea be reality,You are welcome contact us for technical supporting of production.

Support:

Wire bonding Substrate

Wire bonding(BGA)

Substrate Embedded (Memor y IC substrate)

MEMS/CMOS,Module(RF,Wireless ,Bluetooth)

2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole)

Flipchip CSP;

Sip package substrate;

Others ultra ic package substrate

Welcome contact us with Gerber and specifications!

HOREXS GROUP 

Maily production process

TENTING process (35um)-- Improved Tenting (L/S :20/20um ) -- SAP (ABF/BT raw material,L/S:10/10um);

MES+ERP manufacturing system,Smart and fully auto manufacture.

Here is our Tenting Production Process

           Drilling            ⇒         Plating          ⇒         Pattern    ⇒      Exposure    ⇒           Etching         ⇒          AOI&VRS       ⇒   Solder Mask  ⇒  

   Plating Gold    ⇒                ET              ⇒                AVI            ⇒               FQC            ⇒           Cleaning         ⇒           Packging

Horexs people believe that quality is the life of a company.The continuous pursuit of high quality is the guarantee of Horexs's continuous operation. Good hardware equipment provides the driving force for high quality. Strict and strict management system provides guarantee for the increasingly perfect quality. Horexs has strictly followed the strict implementation of the requirements of international quality system standards, constantly updated the advanced equipment, optimize the process, so that customer satisfaction for the purpose, adhere to the principle of prevention-based, test-assisted, and constantly improve themselves.

Horexs insist help customer by technology,Not price,Good quality pcb by manufacturing,not by inspection.Horexs has an advanced manufacture machines in our factory,As a whole process IC substrate manufacturer,Almost our machines are buy from Japan,such as LDI(soldermask,circuit line,Mekki laminate press so on),AOI/AVI. The professional inspection personnel and the factory of each board have passed repeated testing of multiple processes and achieved a good quality rate of 99.7%, which is not inferior to any industry. A ultra thin printed circuit board manufacturer, in the inspection process, each process has professional personnel to operate, use the latest hardware and software, so that each product delivered to the customer is assured products, bad board is manufactured, so Horexs In addition to During the inspection process, we strictly control the inflow of customers and constantly improve our technology and seek the highest yield rate.

Standard:IPC/JEDC,Industrial 4.0

1-Material income control

FR4: Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others

Soldermask:TAIYO INK,ABQ

2-Quality control System(6S management system)

Income material quality control

manufacture process control

Product reliability control

Quality system control(test/checking)

Outgo quality control

after-sales services supporting

R&D technical supporting

Package guarantee(shipping damage)

Reliability testing control

3.Smart&Auto manufacture,MES/ERP system;

Horexs always keep a close eye on the latest development of the industry, and constantly update research and technology innovation strategy, by providing advanced packaging substrate technology solutions, to ensure that companies in the industry's leading technology advantage. "small fine" and "integrated" is including packaging substrate application trend of the development of semiconductor industry chain, thus, in the subsequent few years, the company will focus on the two aspects of research and development and technological innovation.The company's embedded passive component development enables some components to be integrated into the package substrate. The hole size is 40um and below, and the insulation layer is 25um and below, enabling smaller and more compact package solutions.

To protect research and development and innovative technologies, the company has and will continue to apply for patent protection worldwide, including in the United States, China, Japan, South Korea, Taiwan, Israel and European countries.Patent protection includes production processes and product structures that can be implemented by new technologies.The patent strategy not only protects the company from competitors who copy the company's manufacturing process, but also protects the company's product structure by preventing competitors from making products with similar structure by imitating the manufacturing process.

1-MEMS / CMOS(Sesors)

2-MiniLED(Micro LED)

3-Line space/width 35/35um ►Line space/width 20/20um ►Line space/width 10/10um

4-IC substrate Memory(BGA) FCCSP package substrate

5-Sip/BGA/Memory/CSP package substrate

Materials support BT+ABF material(ABF in 2n/3rd Stage of HOREXS Hubei)

Horexs is one of a famous IC Substrate manufacturers in CHINA,Since built our factory in 2009,at the same time,R&D dept was also built.As a shoulder of the motherland cutting-edge technology production enterprises,Horexs 's stock was hold by key employee besides boss in our factory,So Horexs enterprise structure always can promote our production and management,Help customers slove all questions and problem very fast during production,And it can speed up our R&D team effiency,So every year,Our manufacture ability always got improvement.

In order to continously provide our customer best technology service,Horexs always has great relationship with Taiwan technical team,Since in 2015,Horexs already has built a special R&D teams besides old team,Who's once worked at ASE/Windbond/KYEC.