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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

31 - 40 of 140 Selling leads

MCP package Substrate 0.5oz Copper Customize BT Material

MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei ... 2024-12-09 20:39:36

ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct... 2024-12-09 20:39:36

BT material semiconductor Pacakge Substrate L/S 35/35um

BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate... 2024-12-09 20:39:36

BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface

MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you ... 2024-12-09 20:39:36

MGC brand BT CSP package Substrate Fabrication

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2024-12-09 20:39:36

IC Chip Substrate Fabrication with BT(MGC/Hitachi) ENIG/Soft gold/ENEPIG

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor ... 2024-12-09 19:57:48

BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line ... 2024-12-09 19:57:48

BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness

Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0... 2024-12-09 19:57:48

L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2024-12-09 19:57:48

2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package... 2024-12-09 19:55:37

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