China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
Home > Products > RF Module Substrate >

Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

Browse Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details

Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

Brand Name Horexs
Model Number GC-01
Certification UL
Place of Origin china
Minimum Order Quantity 1000pieces
Price US 0.089-0.109 each piece
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability 30000sqm/ month
Delivery Time 7-10 working days
Packaging Details carton customized
type module substrate
Material BT
finished thk. 0.21mm
finished soft gold
Layer 4L
Detailed Product Description

Camera/Bluetooth/Wireless Module substrate manufacture

Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI module/Bluetooth module,Others;

Spec.of Substrate production:

Mini.Line space/width:1mil (35um)

Finished thickness:0.21mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Buildup:1+2+1/2+2+2;

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

 

Short introduction of Horexs Manufacture:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

 

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

 

Want Better price,Better quality Substrate ? Contact Horexs now!

 

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Product Tags: 4L Wireless Module substrate   BT Wireless Module substrate   Soft Gold Module substrate  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: HongRuiXing (Hubei) Electronics Co.,Ltd.
Subject:
Message:
Characters Remaining: (80/3000)