41 - 50 of 132
msap sip packaging substrate
Selling leads
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 21:44:49
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 21:46:53
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 22:05:34
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 22:05:34
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 22:05:34
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..., special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC ...
2024-12-09 21:20:17
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.../Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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.../Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
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