China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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msap sip packaging substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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msap sip packaging substrate

Selling leads
...Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD... 2024-12-09 21:05:17
...Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD... 2024-12-09 21:20:17
...UAV,house electronics,consumer electronics. Product description IC substrate is a type of carry material for integrated circuit with internal ... 2024-12-09 21:20:17
...package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit ... 2024-12-09 21:20:17
...package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support ... 2024-12-09 19:38:04
... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ... 2024-12-09 20:55:08
... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ... 2024-12-09 21:20:17
...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb ... 2024-12-09 19:38:04
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ... 2024-12-09 20:55:08
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ... 2024-12-09 21:20:17
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