51 - 60 of 132
msap sip packaging substrate
Selling leads
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
|
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
|
...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ...
2024-12-09 19:45:11
|
...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ...
2024-12-09 19:45:11
|
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
2024-12-09 19:45:11
|
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ...
2024-12-09 21:44:49
|
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 19:38:04
|
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
2024-12-09 19:45:11
|
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 21:20:17
|
....of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material ...
2024-12-09 19:38:04
|