China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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msap sip packaging substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
51 - 60 of 129

msap sip packaging substrate

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Tenting process 25um DRAM IC package Substrate BT material 4 Layer

Tenting process 25um DRAM IC package Substrate BT material 4 Layer for sale
...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

NAND/FLASH Memory Ic packaging Substrate

NAND/FLASH Memory Ic packaging Substrate for sale
...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

line/space 25um FBGA Package Substrate For Memory ic packaging

line/space 25um FBGA Package Substrate For Memory ic packaging for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

semiconductor FCCSP Package Substrate manufacture

semiconductor FCCSP Package Substrate manufacture for sale
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ... 2024-12-09 21:44:49

FCCSP package substrate 4L Buildup types ENEPIG

FCCSP package substrate 4L Buildup types ENEPIG for sale
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width... 2024-12-09 19:38:04

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

finleLine Space IC Package Substrate for Wearable and Automotive Electronics for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material for sale
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width... 2024-12-09 21:20:17

MicroLED/MniLED package substrate manufacture

MicroLED/MniLED package substrate manufacture for sale
....of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material ... 2024-12-09 19:38:04

BT semiconductor IC packaging substrate manufacture

BT semiconductor IC packaging substrate manufacture for sale
...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ... 2024-12-09 19:38:04

Flash/NAND memory package substrate production

Flash/NAND memory package substrate production for sale
... memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package... 2024-12-09 19:38:04
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