China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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msap sip packaging substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
111 - 120 of 132

msap sip packaging substrate

Selling leads

0.28mm Finished Lead Free memory chip substrate manufacture

0.28mm Finished Lead Free memory chip substrate manufacture for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

4L SD card memory substrate manufacture

4L SD card memory substrate manufacture for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

0.26mm memory substrate fabrication with soft gold plating

0.26mm memory substrate fabrication with soft gold plating for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

UDP/USB memory substrate manufacture supporting

UDP/USB memory substrate manufacture supporting for sale
Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space... 2024-12-09 19:38:04

wire bonding memory substrate with gold plating manufacture

wire bonding memory substrate with gold plating manufacture for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

13 years experience of Nand/Flash memory substrate manufacture

13 years experience of Nand/Flash memory substrate manufacture for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

MGC BT Memory substrate 4L with ENEPIG plating

MGC BT Memory substrate 4L with ENEPIG plating for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

0.2mm 4L BT memory substrate manufacture JEDEC standard

0.2mm 4L BT memory substrate manufacture JEDEC standard for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

RF Module substrate impedance control 4L BT material soft gold

RF Module substrate impedance control 4L BT material soft gold for sale
Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) ... 2024-12-09 19:38:04

Semiconductor sensors substrate manufacture

Semiconductor sensors substrate manufacture for sale
Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of ... 2024-12-09 19:38:04
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