China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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UDP/USB memory substrate manufacture supporting

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details

UDP/USB memory substrate manufacture supporting

Brand Name Horexs
Model Number GC-08
Certification UL
Place of Origin china
Minimum Order Quantity 100pieces
Price US 120-150 per square meter
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability 1000M2/ month
Delivery Time 7-10 working days
Packaging Details carton customized
type IC substrate
dielectric layer TR-4
Material BT/FR4
flame retardant properties V2
Mechanical rigid rigid
Processing technic Electrolytic foil
transport package carton
Detailed Product Description

Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory;

Spec.of substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.2mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

 

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

 

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

 

Want Better price,Better quality ic substrate ? Contact Horexs now!

 

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)


 

Product Tags: 0.15mm Multilayer Flexible Pcb   Immersion Gold Multilayer Flexible Pcb   0.15mm Multilayer Pcb  
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