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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

101 - 110 of 137 Selling leads

wire bonding memory substrate with gold plating manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

UDP/USB memory substrate manufacture supporting

Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space... 2024-12-09 19:38:04

NAND memory package substrate manufacture

Application:NAND memory package,Memory electronics,storage electronics,Flash memory,FBGA/PBGA package,Semiconductor package; Spec.of pcb production: ... 2024-12-09 19:38:04

0.26mm memory substrate fabrication with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

4L SD card memory substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

wirebonding packaging memory substrate with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,UDP/USB memory products others; Spec.of substrate production: Mini... 2024-12-09 19:38:04

Storage IC Package Substrate Pcb

Storage IC package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask ... 2024-12-09 19:38:04

DDR IC Package Substrate Pcb

DDR IC package substrate pcb DDR4/LPDDR,BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Suitable for cell phone... 2024-12-09 19:38:04

eMMC IC Package Substrate PCB

eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support ... 2024-12-09 19:38:04

JEDEC Standard eMCP IC Package Substrate Fabrication

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card... 2024-12-09 19:38:04

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