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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

111 - 120 of 137 Selling leads

Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR

Application: Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD ... 2024-12-09 19:38:04

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics... 2024-12-09 19:38:04

4L build up types 0.8mm Gold Surface IC Package Substrate

Application:Dram memory electronics,IC card,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC ... 2024-12-09 19:38:04

Hitachi brand BT material substrate manufacture

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ... 2024-12-09 19:38:04

0.15mm IC assembly package substrate For semiconductor package

Application:IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR... 2024-12-09 19:38:04

Precision 0.15mm IC Packaging Substrate fabrication

Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR... 2024-12-09 19:38:04

AUS308 PSR IC Package substrate manufacture

Application:UDP memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate... 2024-12-09 19:38:04

Hitachi BT IC Package Substrate production supporting

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ... 2024-12-09 19:38:04

0.2mm 2 layer Memory Card substrate Fabrication For Capsulation

Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory ... 2024-12-09 19:38:04

OEM ODM Gold Bonding IC Package Substrate 4 Layer

Application:IC substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconducto... 2024-12-09 19:38:04

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