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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

121 - 130 of 137 Selling leads

BGA IC Package Substrate With Cap Plated MGC BT material

Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable ... 2024-12-09 19:38:04

HOREXS semiconductor ic package substrate With Chip Wire Bonding

Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly... 2024-12-09 19:38:04

microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of ... 2024-12-09 19:38:04

RF/mmwave module substrate manufacture

Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:38:04

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

OEM ODM semiconductor packaging substrate China mainland

Application:LED keyboards electronics,consumer electronics,telecom.electronics;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; ... 2024-12-09 19:38:04

LED chip ic package substrate manufacture supporting

Application:Semi Package,LED chip package,Semiconductors ,Semiconductor,IC package,miniLED,MicroLED,MEMS,IC assembly,Storage IC substrage; Spec.of ... 2024-12-09 19:38:04

0.28mm Finished Lead Free memory chip substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

Horexs 0.2mm Thickness BGA package substrate full resin plug all holes and cap plating

Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: ... 2024-12-09 19:38:04

MicroLED/MniLED package substrate manufacture

High Precision Fine Pitch LED package substrate with Plating Silver 0.4mm finished BT thickness,ROHS passed Application:Led lighting,LED display,LED ... 2024-12-09 19:38:04

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