immersion gold fr4 substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

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immersion gold fr4 substrate

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big capacity of memory packaging substrate manufacture

... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly ... 2024-12-09 19:38:04

Fingerprint sensors packaging substrate manufacture supporting

...4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic... 2024-12-09 19:38:04

Semiconductor sensors substrate manufacture

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4)... 2024-12-09 19:38:04

FCCSP package substrate 4L Buildup types ENEPIG

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

FCCSP substrate manufacture supporting China

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

QFN package sensors substrate manufacture supporting

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.2mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

BGA/QFN package substrate production for IoT industry semiconductor

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4)... 2024-12-09 19:38:04

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 21:20:17

semiconductor FCCSP Package Substrate manufacture

...3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished... 2024-12-09 21:44:49

4 Layer buildup types semiconductor Package Substrate production

...Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor ... 2024-12-09 20:39:36

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