81 - 90 of 96
immersion gold fr4 substrate
Selling leads
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MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you ...
2024-12-09 20:39:36
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BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
2024-12-09 20:55:08
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BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
2024-12-09 21:20:17
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Description Of IC Substrate pcb Ultrathin FR4 pcb,It's always about from 0.1-0.6mm finished pcb board thickness,But is not belong to ic substrate. ...
2024-12-09 19:38:04
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Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
2024-12-09 19:38:04
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Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
2024-12-09 19:38:04
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Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
2024-12-09 19:38:04
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...thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC...
2024-12-09 19:38:04
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....of pcb production: FR4 (0.15mm) finished thickness; FR4 brand:SHENGYI or customize; Surface finished:immersion gold; Copper:0.5oz or Customize; ...
2024-12-09 19:38:04
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...gold plating ultrathin printed circuit board fabrication with customize/BT FR4/IC substrate Application:Dram memory electronics,Sd card,memory card...
2024-12-09 19:38:04
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