immersion gold fr4 substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

11 - 20 of 96

immersion gold fr4 substrate

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wire bonding memory substrate with gold plating manufacture

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

RF Module substrate impedance control 4L BT material soft gold

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

MicroLED/MiniLED package substrate manufacture

...:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo... 2024-12-09 19:38:04

MGC brand BT CSP package Substrate Fabrication

...substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ... 2024-12-09 20:39:36

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

Sensors package substrate CMOS substrate manufacture supporting

... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04

Sip package substrate BT material 4 layer ENEPIG

...substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness... 2024-12-09 19:38:04

Semiconductor Package Substrate 12um copper buildup types

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

0.26mm BT BGA IC Substrate Board manufacture

... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

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