11 - 20 of 22
35um line wire bonding substrate
Selling leads
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package...
2024-12-09 19:55:37
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... Module substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI ...
2024-12-09 20:55:08
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Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) ...
2024-12-09 19:38:04
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 20:55:08
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 21:20:17
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Application:IC substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconducto...
2024-12-09 19:38:04
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Description Of IC Substrate pcb Ultrathin FR4 pcb boards is also widely using in camera electronics devices,Like CCD camera,camera module etc. ...
2024-12-09 19:38:04
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... High Quality MEMS PCB for Microphone Application:MEMS,sensor MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate ...
2024-12-09 19:38:04
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Description Of IC Substrate pcb 0.12mm ultrathin FR4 print circuit boards is still belong to rigid FR4 pcb boards,ultrathin pcb boards. Application: ...
2024-12-09 19:38:04
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... devices Spec.of pcb production: Mini.Line space/width 35/35um - 20/20um - 10/10um Finished Thk. 0.15mm Raw material SHENGYI,Mitsubishi,mitsuiseiki...
2024-12-09 19:38:04
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