1 - 10 of 22
35um line wire bonding substrate
Selling leads
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
2024-12-09 19:57:48
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
2024-12-09 21:20:17
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...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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...Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold ...
2024-12-09 19:38:04
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... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 20:55:08
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... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 21:20:17
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...Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal ...
2024-12-09 19:38:04
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Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line ...
2024-12-09 19:57:48
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BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate...
2024-12-09 20:39:36
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