China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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camera module PCB substrate manufacture with 0.15mm thickness

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details

camera module PCB substrate manufacture with 0.15mm thickness

Brand Name Horexs
Model Number CC-01
Certification UL
Place of Origin china
Minimum Order Quantity 10 squre meters
Price US 120-150 per square meter
Payment Terms L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability 30000M2/ month
Delivery Time 7-10 working days
Packaging Details carton customized
type rigid pcb
dielectric layer TR-4
Material complex
flame retardant properties V2
core FR4
Processing technic Electrolytic foil
transport package carton
Detailed Product Description

Description Of IC Substrate pcb

Ultrathin FR4 pcb boards is also widely using in camera electronics devices,Like CCD camera,camera module etc.

Application:

  • Camera electronics

Spec.of pcb production:

Mini.Line space/width35/35um - 20/20um - 10/10um
Finished Thk.0.2mm
Raw materialSHENGYI,Mitsubishi,mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others
Surface finishedEING/ ENEPIG/ OSP / Soft gold/ Hard gold etc.
Copper thickness12um
Layer2 layer
Soldermask/PSRGreen Taiyo brand/ AUS 308 / AUS 320 / AUS 410 / SR-1700,300 series

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

FAQ:

  1. Where's HOREXS company location ?

HOREXS group has two factories,Old factory located in huizhou city Guangdong,Another one is located in Hubei provice.

  1. Does HOREXS have MOQ/ MOV ?

HOREXS no set any MOQ / MOV for any clients now.

  1. Can HOREXS produce big volume ic substrate ?

Yes,We can,Our old factory capacity is 15000sqm/month,New factory is 50000sqm/Month.

  1. What we should contact If we are seeking cooperation with HOREXS ?

Contact person:AKEN,email ID: akenzhang@horexspcb.com,Support roadmap/Design rules files,Production capability files.

  1. Does HOREXS support IC package / IC design service ?

No,We dont have it,We are only semiconductor ic substrate manufacture,But we can let our clients to help.

  1. What does HOREXS need when we need quotation ?
  • Gerber files;
  • Production specifications;
  • If multilayer pcb substrate,Also need buildup/stackup information;
  • Others good for quotation files;
  1. Can HOREXS produce FCBGA package substrate now ?

No,From HOREXS roadmap ,HOREXS will start FCBGA substrate manufacture in 2024 or 2025.

 

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Shipping:

  • DHL / UPS / Fedex;
  • By air / By sea;
  • Customize Express (Own account of DHL / UPS/ Fedex)
Product Tags: Substrate Pcb Electronic Board   Pcb Electronic Board For CCD Camera   Horexs Substrate Pcb  
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