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glass hermetically sealed packaging
Selling leads
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...Au≥1.3um;Cap is plated Ni:2~11.43um Product Formation Material Quantity 1. Base 4J29 1 2. Glass insulator BH-A/K 8 3. Pin 4J29 8 4. Cap 4J42 1 ...
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Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ...
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Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ...
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...glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the lead plating Ni:1-11...
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Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip ...
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...:4-11.43um. Product formation: Material Quantity 1. Cap 10#Steel 1 2. Welding ring HLAgCu28 1 3. Lead 1 4J29(Kovar) 1 4. Glass insulator BH-G/K 3 5...
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Product model: TO-46 Product name: Suitable Coining Round Styles Pedestal Leads Are Perpendicular To The Substrate Mounting Surface Finish: Fully ...
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