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hybrid integrated circuit package
Selling leads
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Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ...
2025-05-13 09:46:55
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Technical characteristics: Micro channel heat sink Flatness of chip mounting area ≤ 2 um Roughness of chip mounting area ≤ 0.3 um Plating thickness: ...
2025-05-13 09:46:55
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Product name: High quality Customized Ceramic To Metal Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 ...
2025-05-13 09:46:55
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Product name: Metal Base Cavity Kovar/Aluminium Package for IC Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating Coating ...
2025-05-13 09:46:55
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