China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
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hermetic high power laser package

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hermetic high power laser package

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Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
Product name: Suitable Deep Drawing 42 Alloy Housing Leads Perpendicular To The Substate Mounting Surface Finish: Fully plating Au or selective ... 2025-05-13 09:46:55
Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip ... 2025-05-13 09:46:55
Main performance parameters Application field: pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm ... 2025-05-13 09:46:55
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