China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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glass hermetically sealed packaging

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...;and Au≥1um Product Structure Material Quantity 1. eyelet 4J29 1 2. lead 4J29 8 3. glass insulator DM-305 8 4. cap 4J29 1 Insulation resistance ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator Lead welding method: ... 2025-05-13 09:46:55
Product name: Electronic Components Enclosures Cavity Rf Microwave Package Finish: Fully plating Au(or choose selective plating). Plating coating: The ... 2025-05-13 09:46:55
...glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the lead plating Ni:1-11... 2025-05-13 09:46:55
...performance parameters Application fields: optical communication module package Lead welding method: tin welding, gold wire bonding Nickel plating ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical Switch And Optic Fiber Gyroscope Lead welding method: tin welding, gold wire bonding Nickel ... 2025-05-13 09:46:55
Product name: Suitable Deep Drawing 42 Alloy Housing Leads Perpendicular To The Substate Mounting Surface Finish: Fully plating Au or selective ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
... ≥0.75um;Lid is plated Au ≥0.6um Product Formation Material Quantity 1 Base Wu80Cu20 1 2. Frame 4J29 1 3. Pin 4J29 6 4. Glass Insulator BH-A/K 6 5. ... 2025-05-13 09:46:55
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