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glass hermetically sealed packaging
Selling leads
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... are plated Au≥1.0um Product formation: Material Quantity 1. Cover plate 4J42(42alloy) 1 2. Welding ring HLAgCu28 3 3. Glass insulator BH-C/K 5 4. ...
2025-05-13 09:46:55
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...hermetically sealing circular package Plating: The bottom plate, the lead plating Ni:3-8.9um, the bottom plate and the lead plating Au>=0.03um. ...
2025-05-13 09:46:55
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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ...
2025-05-13 09:46:55
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... coating: Package,pin,lid are plated Ni:1.3~11.43um;Package and pins are plated Au≥1.0um Product formation: Material Quantity 1. Cover plate 4J42...
2025-05-13 09:46:55
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Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ...
2025-05-13 09:46:55
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...Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 lead 2 copper cored alloy 8 insulator Al2O3 12 ...
2025-05-13 09:46:55
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Product name: Highly Customized High Frequency Microwave Package Finish: Fully plating Au(or choose selective plating). Plating coating: The package, ...
2025-05-13 09:46:55
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...≥1um;Cap is plated Ni:1.3~11.43um Insulation resistance 500V DC resistance between single pin and shell is ≥1*1010Ω Hermeticity Leak rate is ≤1*10...
2025-05-13 09:46:55
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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ...
2025-05-13 09:46:55
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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ...
2025-05-13 09:46:55
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