China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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glass hermetically sealed packaging

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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...uncooled infrared detectors. The main package forms are butterfly ceramic package, ceramic PGA package and ring ceramic package, which can ... 2025-05-13 09:46:55
...Package With 4J29 Alloy Product formation Material Quantity 1. bottom 4J29 1 2. lead 4J29 5 3. T shaped lead 4J29 1 4. glass insulator DM-305 5 5. ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
Product name: Fiber optic electronic component housing Material: Housing kovar ring; kovar lead; base Wcu ; ceramic insulator. Finish: Fully plating ... 2025-05-13 09:46:55
... 1 4J29(Kovar) 1 2. Lead 2 4J29(Kovar) 3 3. Glass insulators BH-G/K 3 4. Bottom floor SPCC 1 Insulation resistance 100V DC resistance between ... 2025-05-13 09:46:55
...Pin2 Kovar 1 Insulation Resistance 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features ... 2025-05-13 09:46:55
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