| Product name: | Sealed enclosure alloy package for circuit |
| Finish: | Fully plating Au or selective plating Au. |
| Plating coating: | Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap
plating Ni:4-11.43um. |
| Product formation: | Material | Quantity |
| 1. Cap | 10#Steel | 1 |
| 2. Welding ring | HLAgCu28 | 1 |
| 3. Lead 1 | 4J29(Kovar) | 1 |
| 4. Glass insulator | BH-G/K | 3 |
| 5. Lead 2 | 4J29(Kovar) | 3 |
| 6. Bottom floor | 4J29(Kovar) | 1 |
| Insulation resistance | 500V DC resistance between single glass sealed pin and shell is
≥1*1010Ω |
| Hermeticity | Leak rate is ≤1*10-3Pa.cm3/s |
| Product features: | 1. Shell adopt material:FeNiCo,FeNi42 or CRS; |
| 2. The shape of pin is cyclinder and straight,material adopts
Kovar. |
| 3. The sealing cap method is percussion welding or tin welding. |
4. The rank of pin which cross the bottom of base could be choosen by customers. |
| 5. The position of ground pin can be choosen by customer. |
| 6. The design of caps need to fit the shell. |
| 7. Customer could choose shell fully plating or pin selective
plating. |
