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storage ic package substrate pcb
Selling leads
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Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ...
2024-12-09 20:55:08
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...package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controller...
2024-12-09 20:55:08
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Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ...
2024-12-09 21:44:49
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Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 19:38:04
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Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 21:20:17
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COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct...
2024-12-09 20:39:36
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Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package...
2024-12-09 19:55:37
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...Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is ...
2024-12-09 20:39:36
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....of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material ...
2024-12-09 19:38:04
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate...
2024-12-09 19:55:37
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