41 - 50 of 120
storage ic package substrate pcb
Selling leads|
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
|
|
... memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package...
2024-12-09 19:38:04
|
|
...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ...
2024-12-09 19:38:04
|
|
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage...
2024-12-09 19:38:04
|
|
BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
2024-12-09 20:55:08
|
|
BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
2024-12-09 21:20:17
|
|
Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...
2024-12-09 20:55:08
|
|
Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...
2024-12-09 21:20:17
|
|
...,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,...
2024-12-09 19:57:48
|
|
COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct...
2024-12-09 20:39:36
|
