China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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mcp fr4 substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
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mcp fr4 substrate

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Hitachi BT IC Package Substrate production supporting

Hitachi BT IC Package Substrate production supporting for sale
...substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly... 2024-12-09 19:38:04

Precision 0.15mm IC Packaging Substrate fabrication

Precision 0.15mm IC Packaging Substrate fabrication for sale
...IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC ... 2024-12-09 19:38:04

0.15mm IC assembly package substrate For semiconductor package

0.15mm IC assembly package substrate For semiconductor package for sale
...IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC ... 2024-12-09 19:38:04

Hitachi brand BT material substrate manufacture

Hitachi brand BT material substrate manufacture for sale
...substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly... 2024-12-09 19:38:04

ENEPIG plating ic package substrate manufacture

ENEPIG plating ic package substrate manufacture for sale
...substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-... 2024-12-09 19:45:11

Customizable coreless IC Package Substrate with 0.09mm Thickness

Customizable coreless IC Package Substrate with 0.09mm Thickness for sale
...Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory ... 2024-12-09 21:05:17

Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant

Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant for sale
...Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF ... 2024-12-09 21:05:17

Precision 0.15mm IC Package Substrate Fabrication V2 Flame Retardant

Precision 0.15mm IC Package Substrate Fabrication V2 Flame Retardant for sale
...Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF ... 2024-12-09 21:20:17

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing for sale
...IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC ... 2024-12-09 21:20:17

BT semiconductor IC packaging substrate manufacture

BT semiconductor IC packaging substrate manufacture for sale
... package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; ... 2024-12-09 19:38:04
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