41 - 50 of 112
mcp fr4 substrate
Selling leads
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... ; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly ...
2024-12-09 19:38:04
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...substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory,NAND Flash ...
2024-12-09 20:55:08
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...,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; ...
2024-12-09 19:38:04
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... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...
2024-12-09 19:38:04
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... packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:38:04
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...substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory ...
2024-12-09 19:55:37
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...substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor ...
2024-12-09 19:55:37
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...Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor ...
2024-12-09 20:39:36
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...substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate...
2024-12-09 19:38:04
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...substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; ...
2024-12-09 19:47:52
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