gold plating ic package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

61 - 70 of 135

gold plating ic package substrate

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Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ... 2024-12-09 20:55:08

High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR

...package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controller... 2024-12-09 20:55:08

Flash/NAND memory package substrate production

... memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package... 2024-12-09 19:38:04

Multilayer BT materials semiconductor package substrate manufacture

...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ... 2024-12-09 19:38:04

2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package... 2024-12-09 19:55:37

4 Layer buildup types semiconductor Package Substrate production

...Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate... 2024-12-09 20:39:36

MCP package Substrate 0.5oz Copper Customize BT Material

...Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is ... 2024-12-09 20:39:36

CMOS sensors ic package manufacture supporting

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage... 2024-12-09 19:38:04

FBGA Package substrate production supporting BT 40um core

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate... 2024-12-09 19:55:37

MGC brand BT CSP package Substrate Fabrication

...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil ... 2024-12-09 20:39:36

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