101 - 110 of 135
gold plating ic package substrate
Selling leads
|
...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil ...
2024-12-09 21:20:17
|
|
...IC Substrate pcb IC substrate, also known as packaging substrate, is an important raw material for integrated circuit packaging, to provide ...
2024-12-09 19:38:04
|
|
Camera/Bluetooth/Wireless Module substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera ...
2024-12-09 20:55:08
|
|
...IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; ...
2024-12-09 19:38:04
|
|
...,the semiconductor packaging substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of ...
2024-12-09 19:38:04
|
|
...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
|
|
...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
|
|
...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
|
|
...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
|
|
...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
|