41 - 50 of 135
gold plating ic package substrate
Selling leads
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 22:05:34
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 22:05:34
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 22:05:34
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
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...,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,...
2024-12-09 19:57:48
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 21:44:49
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...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ...
2024-12-09 19:45:11
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...IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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...IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 21:20:17
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