31 - 40 of 106
fr4 finished bga substrate
Selling leads
|
...substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished ...
2024-12-09 19:57:48
|
|
... ; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly ...
2024-12-09 19:38:04
|
|
...substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory,NAND Flash ...
2024-12-09 20:55:08
|
|
... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located ...
2024-12-09 20:39:36
|
|
... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...
2024-12-09 19:38:04
|
|
...FR4 Material Pcb Circuit Board Of High Precision SD Card PCB With Bright Golden Finger 50u"Gold Thickness ROHS Application:Sd card,memory card,all ...
2024-12-09 19:38:04
|
|
...substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
2024-12-09 19:38:04
|
|
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you ...
2024-12-09 20:39:36
|
|
...substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT ...
2024-12-09 19:38:04
|
|
...substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI module...
2024-12-09 20:55:08
|