1 - 10 of 106
fr4 finished bga substrate
Selling leads
|
...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width...
2024-12-09 19:57:48
|
|
...: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer...
2024-12-09 19:55:37
|
|
...substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI...
2024-12-09 19:38:04
|
|
...substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory ...
2024-12-09 19:55:37
|
|
...substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec...
2024-12-09 19:55:37
|
|
...UAV,house electronics,consumer electronics. Product description IC substrate is a type of carry material for integrated circuit with internal ...
2024-12-09 21:20:17
|
|
...substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor ...
2024-12-09 19:55:37
|
|
...substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:57:48
|
|
...substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 21:20:17
|
|
...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package...
2024-12-09 19:55:37
|