41 - 50 of 134
enepig fr4 package substrate
Selling leads
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... MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:38:04
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...Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash ...
2024-12-09 21:05:17
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...Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD...
2024-12-09 21:05:17
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...Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD...
2024-12-09 21:20:17
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... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant ...
2024-12-09 20:55:08
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...package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit ...
2024-12-09 21:20:17
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... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 20:55:08
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... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 21:20:17
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... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:38:04
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... thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:38:04
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