enepig fr4 package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

71 - 80 of 134

enepig fr4 package substrate

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finleLine Space IC Package Substrate for Wearable and Automotive Electronics

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

Anylayer/Buildup types Sip packaging Substrate manufacture

Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness... 2024-12-09 19:38:04

BT semiconductor IC packaging substrate manufacture

...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ... 2024-12-09 19:38:04

Multilayer BT materials semiconductor package substrate manufacture

...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ... 2024-12-09 19:38:04

BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG

...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width... 2024-12-09 19:57:48

BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

...substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec... 2024-12-09 19:55:37

L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL

...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil ... 2024-12-09 21:20:17

L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil ... 2024-12-09 19:57:48

IC Chip Substrate Fabrication with BT(MGC/Hitachi) ENIG/Soft gold/ENEPIG

... electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly ... 2024-12-09 19:57:48

ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material

....Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC... 2024-12-09 19:55:37

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