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dram memory packaging fr4 substrate
Selling leads
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... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 20:55:08
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... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 21:20:17
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...; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished...
2024-12-09 21:44:49
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Description Of IC Substrate pcb IC substrate is a technology developed with the continuous progress of semiconductor packaging technology. In the mid...
2024-12-09 19:38:04
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...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ...
2024-12-09 19:45:11
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...IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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...IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 21:20:17
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...package,MEMS,CMOS,IC substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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...substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI module...
2024-12-09 20:55:08
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...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ...
2024-12-09 19:45:11
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