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dram memory packaging fr4 substrate
Selling leads
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... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...
2024-12-09 19:38:04
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... ; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly ...
2024-12-09 19:38:04
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 21:44:49
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 21:46:53
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 22:05:34
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 22:05:34
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 22:05:34
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...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC ...
2024-12-09 22:05:34
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...,the semiconductor packaging substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of ...
2024-12-09 19:38:04
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...Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality ...
2024-12-09 19:38:04
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