ddr ic package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

1 - 10 of 137

ddr ic package substrate

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DDR IC Package Substrate Pcb

...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb ... 2024-12-09 19:38:04

Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant

...IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard... 2024-12-09 21:05:17

Precision 0.15mm IC Package Substrate Fabrication V2 Flame Retardant

...IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard... 2024-12-09 21:20:17

Customizable coreless IC Package Substrate with 0.09mm Thickness

...IC Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card... 2024-12-09 21:05:17

Precision 0.15mm IC Packaging Substrate fabrication

...IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package... 2024-12-09 19:38:04

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

...IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package... 2024-12-09 21:20:17

Hitachi BT IC Package Substrate production supporting

...DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card... 2024-12-09 19:38:04

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

NAND/FLASH Memory Ic packaging Substrate

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

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