51 - 60 of 137
ddr ic package substrate
Selling leads
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ...
2024-12-09 21:44:49
|
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 19:38:04
|
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 21:20:17
|
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package...
2024-12-09 19:55:37
|
...Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is ...
2024-12-09 20:39:36
|
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage...
2024-12-09 19:38:04
|
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate...
2024-12-09 19:55:37
|
... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located ...
2024-12-09 20:39:36
|
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash ...
2024-12-09 19:55:37
|
... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant ...
2024-12-09 20:55:08
|