customize soldermask bga substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

51 - 60 of 70

customize soldermask bga substrate

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Sensors package substrate CMOS substrate manufacture supporting

...),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP... 2024-12-09 19:38:04

Semiconductor Package Substrate 12um copper buildup types

...),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP... 2024-12-09 19:45:11

25um BT IC Package Substrate Soft gold plating

...),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP... 2024-12-09 19:45:11

UDP/USB memory substrate manufacture supporting

...),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP... 2024-12-09 19:38:04

big capacity of memory packaging substrate manufacture

...),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP... 2024-12-09 19:38:04

FCCSP package substrate 4L Buildup types ENEPIG

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

FCCSP substrate manufacture supporting China

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

QFN package sensors substrate manufacture supporting

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.2mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 21:20:17

semiconductor FCCSP Package Substrate manufacture

...),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP... 2024-12-09 21:44:49

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