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customize soldermask bga substrate
Selling leads
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package...
2024-12-09 19:55:37
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...substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI...
2024-12-09 19:38:04
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Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package...
2024-12-09 19:55:37
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MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei ...
2024-12-09 20:39:36
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...),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP...
2024-12-09 19:38:04
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...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width...
2024-12-09 19:57:48
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COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct...
2024-12-09 20:39:36
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...substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished ...
2024-12-09 19:57:48
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...substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: ...
2024-12-09 19:55:37
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...substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:57:48
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